A new type of fluoropolymer film with superior metal adhesiveness.
Perfect for uses that require insulation or involve hot and humid environments.
Perfect for uses that require insulation or involve hot and humid environments.
Features
- Robust adhesion without the need to preprocess film or use a bonding agent.
- Excellent adhesion with metals such as copper and aluminum.
- Can also bond to inorganics such as ceramics and glass.
- Bonds to highly heat-resistant polymers such as fluoropolymer and polyimide.
- Features all of the benefits of fluoropolymers, including high heat durability, insulation, chemical resistance, low water absorption, low outgassing, and flame resistance.
- Excellent adhesion with metals such as copper and aluminum.
- Can also bond to inorganics such as ceramics and glass.
- Bonds to highly heat-resistant polymers such as fluoropolymer and polyimide.
- Features all of the benefits of fluoropolymers, including high heat durability, insulation, chemical resistance, low water absorption, low outgassing, and flame resistance.
Use
- Fluoropolymer circuit boards
| Adhesive PFA Film | ||
| Material | PFA | |
| Film Thickness (㎛) | 12.5～100 | |
| Film Width (mm) | 100～600 | |
| Bonding Conditions | Temperature (℃) | 320 |
| Pressure (MPa) | 1.5 | |
| Time (Minutes) | 10 | |
Adhesive Performance and Peel Strength
| Bonded Material | Adhesive Performance | Peel Strength (N/cm) |
| General Copper Foil | Good | 13 |
| Rolled Copper Film | Good | 9 |
| Polyimido | Good | 9.5 |
| Glass (Quartz Glass) | Acceptable | 3.2 |
| Aluminum Foil | Good | 9.5 |
| Ceramic (Alumina Oxide) | Good | 10.5 |
Sample film: 25μm thickness, 180° peeling test
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